Modeling of touch mode capacitive sensors and diaphragms

This publication has 9 references indexed in Scilit:

• Variational method for tensile stress evaluation and application to heavily boron-doped square-shaped silicon diaphragms
  Sensors and Actuators A: Physical, 1995
• A study of residual stress distribution through the thickness of p/sup +/ silicon films (thermal oxidation effects)
  IEEE Transactions on Electron Devices, 1993
• Micromachined sensor structures with linear capacitive response
  Sensors and Actuators A: Physical, 1992
• Silicon Wafer Bonding Mechanism for Silicon-on-Insulator Structures
  Japanese Journal of Applied Physics, 1990
• Plastic deformation of higly doped Silicon
  Sensors and Actuators A: Physical, 1990
• Residual stress and mechanical properties of boron-doped p+-silicon films
  Sensors and Actuators A: Physical, 1990
• A study on silicon-diaphragm buckling
  1990
• Fabrication and Characterization of Si Membranes
  Journal of the Electrochemical Society, 1988
• Silicon as a mechanical material
  Proceedings of the IEEE, 1982