Compact Modeling and Comparative Analysis of Silicon-Chip Slow-Wave Transmission Lines With Slotted Bottom Metal Ground Planes
Authors:
- 21 March 2009
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 57 (4) , 840-847
Abstract
A compact modeling approach for silicon-chip slow-wave transmission lines with slotted bottom metal ground planes is studied and its limitations are presented. The modeling approach facilitates the calculation of the slow-wave transmission line parameters based upon the corresponding coplanar and grounded coplanar transmission-line parameters. The described analysis method is used for a comparative study of the slow-wave structures versus their coplanar and grounded coplanar reference structures. Floating bottom shield slow-wave transmission lines are then compared with their grounded bottom shield counterparts. The theoretical results are supported by electromagnetic simulations and by measurements up to 30 and 50 GHz.Keywords
This publication has 15 references indexed in Scilit:
- A 25 GHz 3.3 dB NF low noise amplifier based upon slow wave transmission lines and the 0.18 μm CMOS technology2008
- Shielded Passive Devices for Silicon-Based Monolithic Microwave and Millimeter-Wave Integrated CircuitsIEEE Journal of Solid-State Circuits, 2006
- High-Speed Interconnects With Underlayer Orthogonal Metal GridsIEEE Transactions on Advanced Packaging, 2004
- An improved de-embedding technique for on-wafer high-frequency characterization2002
- A de-embedding technique for interconnects2002
- Enhanced transmission characteristics of on-chip interconnects with orthogonal gridded shieldIEEE Transactions on Advanced Packaging, 2001
- Quasi-TEM description of MMIC coplanar lines including conductor-loss effectsIEEE Transactions on Microwave Theory and Techniques, 1993
- S-parameter-based IC interconnect transmission line characterizationIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Simple formulas for two- and three-dimensional capacitancesIEEE Transactions on Electron Devices, 1983
- Variation of microstrip impedance with strip thicknessElectronics Letters, 1969