Decomposition characteristics of SF6 under thermal fault for temperatures below 400°C
Authors:
- 16 June 2014
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Dielectrics and Electrical Insulation
- Vol. 21 (3) , 995-1004
Abstract
This paper aims to explore the decomposition characteristics of SF 6 under thermal fault, which can further improve the method of using SF 6 decomposed components to diagnose inner insulation status of SF 6 insulated equipment. Hence, the thermal fault simulation system of SF 6 electrical equipment is designed and serials of experiments are conducted. It initially gets SF 6 thermal decomposition characteristic for temperature below 400°C. Then it analyzes decomposed component species and their generation regularity, determines the main characteristic component of SF 6 thermal decomposition and chooses the key component to represent fault severity. The result shows that: SF 6 begins to decompose obviously at 300°C and the main decomposition components contain CO 2 , SO 2 F 2 , SOF 2 , SOF 4 , SO 2 and H 2 S; the improvement of fault temperature will promote the decomposition of SF 6 , but the formation regularity of each decomposed component is different; H 2 S is the special component only appears when thermal fault proceeds to some degree (above 360°C). Hence, decomposed components and their formation regularity can be used to diagnose the SF 6 equipment thermal fault. H 2 S can be used as the key component to represent fault severity.Keywords
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