Electromigration failure in flip chip solder joints due to rapid dissolution of copper
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- 1 November 2003
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 18 (11) , 2544-2548
Abstract
An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.Keywords
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