Adhesion and adhesion changes at the copper metal–(acrylonitrile–butadiene–styrene) polymer interface
Authors:
- S. KisinSKS. Kisin
- P.G.Th. van der VarstPVP.G.Th. van der Varst
- G. de WithGWG. de With
- 1 June 2007
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 515 (17) , 6853-6859
Abstract
No abstract availableThis publication has 18 references indexed in Scilit:
- Adhesion on the Nano‐ and Macroscale: Interaction between Copper and SAN/SMAh CopolymersChemphyschem, 2006
- Some recent progress in adhesion technology and scienceComptes Rendus. Chimie, 2005
- Computational Studies of Contact Time Dependence of Adhesive Energy Due to Redistribution of the Locations of Strong Specific Interfacial InteractionsMacromolecules, 2004
- Analysis of the T-peel strength in a Cu/Cr/Polyimide systemActa Materialia, 2002
- Surface modification and lamination of polymers by photograftingInternational Journal of Adhesion and Adhesives, 1999
- Electrochemical impedance study of the degradation of organic-coated copperSurface and Coatings Technology, 1998
- Effect of Chemical Functionality on Adhesion HysteresisLangmuir, 1997
- Adhesion: Molecules and MechanicsScience, 1994
- Direct measurement of structural forces between two surfaces in a nonpolar liquidThe Journal of Chemical Physics, 1981
- How Glue SticksNature, 1957