Effect of Ag addition on the tensile deformation behavior of Bi based alloys at low strain rate
Authors:
- Yan WangYWYan Wang
- Zhe-Feng XuZXZhe-Feng Xu
- Hui-Hui ZhangHZHui-Hui Zhang
- Meng-Ying ZhuMZMeng-Ying Zhu
- Rui-Dong YangRYRui-Dong Yang
- Cai-Li TianCTCai-Li Tian
- Chang-Zeng FanCFChang-Zeng Fan
- Satoshi MotozuKaSMSatoshi MotozuKa
- Kazuhiro MatsugiKMKazuhiro Matsugi
- Jin-Ku YuJYJin-Ku Yu
Open Access
- 8 May 2025
- journal article
- Published by Elsevier in Journal of Materials Research and Technology
- Vol. 36, 7870-7880
Abstract
No abstract availableFunding Information
- Hebei Provincial Department of Human Resources and Social Security
- Department of Human Resources
- Natural Science Foundation of Hebei Province (E2020100006)
- Natural Science Foundation of Hebei Province (E2020203158)
- Hebei Academy of Science (24704)
- National Natural Science Foundation of China (52173231)
This publication has 51 references indexed in Scilit:
- Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder AlloysJournal of Electronic Materials, 2019
- Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder AlloyJournal of Electronic Materials, 2019
- Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder JointsJournal of Electronic Materials, 2017
- Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single CrystalsJournal of Electronic Materials, 2017
- Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper SubstrateJournal of Electronic Materials, 2013
- Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu SubstratesJournal of Electronic Materials, 2009
- Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering ApplicationsJournal of Electronic Materials, 2007
- Thermal and Tensile Properties of Bi-Ag AlloysMetallurgical and Materials Transactions A, 2007
- Interfacial reactions between Bi-Ag high-temperature solders and metallic substratesJournal of Electronic Materials, 2006
- High Melting Pb‐Free Solder Alloys for Die‐Attach ApplicationsAdvanced Engineering Materials, 2005