Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Authors:
- Zhong-Jie HongZHZhong-Jie Hong
- Demin LiuDLDemin Liu
- Han-Wen HuHHHan-Wen Hu
- Chien-Kang HsiungCHChien-Kang Hsiung
- Chih-I ChoCCChih-I Cho
- Chih-Han ChenCCChih-Han Chen
- Jui-Han LiuJLJui-Han Liu
- Ming-Wei WengMWMing-Wei Weng
- Mu-Ping HsuMHMu-Ping Hsu
- Ying-Chan HungYHYing-Chan Hung
- Kuan-Neng ChenKCKuan-Neng Chen
- 28 October 2022
- journal article
- research article
- Published by Elsevier in Applied Surface Science
- Vol. 610
Abstract
No abstract availableKeywords
This publication has 38 references indexed in Scilit:
- Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid BondingECS Journal of Solid State Science and Technology, 2016
- An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates2015
- Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D IntegrationIEEE Electron Device Letters, 2013
- Unconventional applications of wire bonding create opportunities for microsystem integrationJournal of Micromechanics and Microengineering, 2013
- Low-Temperature Cu-Cu Wafer BondingECS Transactions, 2013
- MEMS packaging and reliability: An undividable coupleMicroelectronics Reliability, 2012
- Wafer-level Cu–Cu bonding technologyMicroelectronics Reliability, 2012
- Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiolApplied Physics Letters, 2009
- Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder jointsActa Materialia, 2009
- Room temperature Cu–Cu direct bonding using surface activated bonding methodJournal of Vacuum Science & Technology A, 2003