Stable microencapsulated phase change materials with ultrahigh payload for efficient cooling of mobile electronic devices

Authors:
  • XZXiangyu Zhu
    Xiangyu Zhu
  • XLXiang Li
    Xiang Li
  • JSJiajun Shen
    Jiajun Shen
  • BWBijia Wang
    Bijia Wang
  • ZMZhiping Mao
    Zhiping Mao
  • HXHong Xu
    Hong Xu
  • XFXueling Feng
    Xueling Feng
  • XSXiaofeng Sui
    Xiaofeng Sui

Abstract
No abstract available
Funding Information
  • Fundamental Research Funds for the Central Universities (2232018A3-04)

This publication has 36 references indexed in Scilit: