Interface step-induced thin-film delamination and buckling

This publication has 31 references indexed in Scilit:

• A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems
  Thin Solid Films, 2010
• From thin film and coating buckling structures to mechanical properties
  Materials Science and Engineering: A, 2008
• Modeling the buckling and delamination of thin films
  Physical Review B, 2007
• Buckling phenomena in Y2O3 thin films on GaAs substrates
  Applied Physics Letters, 2003
• The characterization of telephone cord buckling of compressed thin films on substrates
  Journal of the Mechanics and Physics of Solids, 2002
• Interfacial toughness measurements for thin films on substrates
  Acta Materialia, 2002
• Stability of Straight Delamination Blisters
  Physical Review Letters, 1999
• The thermomechanical integrity of thin films and multilayers
  Acta Metallurgica et Materialia, 1995
• Plane-strain, buckling-driven delamination of thin films: Model experiments and mode-II fracture
  Acta Metallurgica et Materialia, 1992
• Festigkeitsprobleme im Maschinenbau
  1907