TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system
Authors:
- C.E. HoCHC.E. Ho
- M.K. LuMLM.K. Lu
- P.T. LeePLP.T. Lee
- Y.H. HuangYHY.H. Huang
- W.L. ChouWCW.L. Chou
- 1 October 2017
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 706, 269-278
Abstract
No abstract availableFunding Information
- Ministry of Science and Technology (MOST105-2628-E-155-001-MY3, MOST105-2221-E-155-006-MY2, and MOST106-2622-E-155-006-CC3)
This publication has 28 references indexed in Scilit:
- Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and NiJournal of Alloys and Compounds, 2010
- Effect of Cu content on the mechanical reliability of Ni/Sn–3.5Ag systemJournal of Materials Research, 2007
- Effects of limited cu supply on soldering reactions between SnAgCu and NiJournal of Electronic Materials, 2006
- Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrationsMaterials Science and Engineering: A, 2005
- Interfacial reactions between lead-free solders and common base materialsMaterials Science and Engineering: R: Reports, 2005
- Six cases of reliability study of Pb-free solder joints in electronic packaging technologyMaterials Science and Engineering: R: Reports, 2002
- Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiJournal of Electronic Materials, 2002
- Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and NiChemistry of Materials, 2002
- Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu soldersJournal of Materials Research, 2002
- Tin–lead (SnPb) solder reaction in flip chip technologyMaterials Science and Engineering: R: Reports, 2001