An investigation on diffusion bonding of Cu/Cu using various grain size of Ni interlayers at low temperature
Authors:
- Tong LinTLTong Lin
- Chun LiCLChun Li
- Xiaoqing SiXSXiaoqing Si
- Xinru LiXLXinru Li
- Bo YangBo Yang
- Jicai FengJFJicai Feng
- Jian CaoJCJian Cao
- 1 December 2020
- journal article
- research article
- Published by Elsevier in Materialia
- Vol. 14
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China
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