Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
Authors:
- Van Nhat LeVLVan Nhat Le
- Lahouari BenabouLBLahouari Benabou
- Victor EtgensVEVictor Etgens
- Quang Bang TaoQTQuang Bang Tao
Top Cited Papers
- 1 October 2016
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 65, 243-254
Abstract
No abstract availableKeywords
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