Microstructure evolution and interfacial bonding mechanisms of ultrasonically soldered sapphire/Al dissimilar joints using Sn-based solders
Authors:
- Jiale LvJLJiale Lv
- Yong XiaoYXYong Xiao
- Bo LiuBLBo Liu
- Bei LiBLBei Li
- Jian ZhangJZJian Zhang
- Shikuan SunSSShikuan Sun
- Dan LuoDLDan Luo
- 13 April 2022
- journal article
- research article
- Published by Elsevier in Ceramics International
- Vol. 48 (14) , 20070-20077
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51605357, 52171045)
- Engineering and Physical Sciences Research Council (/ EP/ S032169/1)
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