MicroDAC strain measurement for electronics packaging structures
Authors:
- D VogelDVD Vogel
- V GrosserVGV Grosser
- A SchubertASA Schubert
- B MichelBMB Michel
- 1 August 2001
- journal article
- Published by Elsevier in Optics and Lasers in Engineering
- Vol. 36 (2) , 195-211
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Advances in Stress Test Chips1997
- Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ InterferometryJournal of Electronic Packaging, 1995
- Thermal Deformations in Electronic Packaging1994
- Residual stress and thermal expansion of spun‐on polyimide filmsJournal of Applied Polymer Science, 1987