Paramagnetic Ge dangling bond type defects at (100)Si1−xGex/SiO2 interfaces (Invited Paper)
Authors:
- 30 September 2009
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 86 (7-9) , 1621-1625
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Defect levels of dangling bonds in silicon and germanium through hybrid functionalsPhysical Review B, 2008
- Interface control of high-k gate dielectrics on GeApplied Surface Science, 2008
- Germanium MOSFET Devices: Advances in Materials Understanding, Process Development, and Electrical PerformanceJournal of the Electrochemical Society, 2008
- Dangling-bond defects and hydrogen passivation in germaniumApplied Physics Letters, 2007
- Interface traps and dangling-bond defects in (100)Ge∕HfO2Applied Physics Letters, 2005
- Germanium MOS capacitors incorporating ultrathin high-/spl kappa/ gate dielectricIEEE Electron Device Letters, 2002
- Electron spin resonance features of interface defects in thermal (100)Si/SiO2Journal of Applied Physics, 1998
- Passivation of P b0 and P b1 interface defects in thermal (100) Si/SiO2 with molecular hydrogenApplied Physics Letters, 1996
- The silicon-silicon dioxide system: Its microstructure and imperfectionsReports on Progress in Physics, 1994
- Kinetics of passivation of centers at the (111) Si- interfacePhysical Review B, 1988