Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction method
Authors:
- 1 September 2006
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 35 (9) , 1755-1760
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Microstructural evolution of lead-free Sn-Bi-Ag-Cu SMT joints during agingIEEE Transactions on Advanced Packaging, 2005
- Synthesis and Characterization of Lead-Free Solders with Sn-3.5Ag-xCu (x=0.2, 0.5, 1.0) Alloy Nanoparticles by the Chemical Reduction MethodJournal of the Electrochemical Society, 2005
- Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloyingJournal of Electronic Materials, 2004
- Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloyingJournal of Electronic Materials, 2003
- Emerging Materials Challenges in Microelectronics PackagingMRS Bulletin, 2003
- Electrochemically Deposited Tin-Silver-Copper Ternary Solder AlloysJournal of the Electrochemical Society, 2002
- Pb-free solders for flip-chip interconnectsJOM, 2001
- Reactions of lead-free solders with CuNi metallizationsJournal of Electronic Materials, 2000
- Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloyingJournal of Electronic Materials, 2000
- Tin-silver-copper eutectic temperature and compositionMetallurgical and Materials Transactions A, 2000