Effect of Interfacial Compound Formation on Contact Resistivity of Soldered Junctions Between Bismuth Telluride-Based Thermoelements and Copper
Authors:
- 1 January 2007
- journal article
- Published by The Electrochemical Society in Electrochemical and Solid-State Letters
- Vol. 10 (9) , P23-P25
Abstract
Two different solder alloys, and , were used to joint p- and n-type bismuth telluride-based thermoelements with copper. and were identified to be the major interfacial compounds for the and soldered junctions, respectively. The contact resistivity measured is around , which depends on both the thickness and composition of interfacial compounds. The study shall lead to the effective strategy for choosing appropriate solder alloy systems to improve the contact property of bismuth telluride-based thermoelectric coolers.Keywords
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