Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance
Authors:
- Gilbert De MeyGMGilbert De Mey
- Bjorn VermeerschBVBjorn Vermeersch
- 27 November 2007
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 30 (4) , 660-665
Abstract
It will be shown in this contribution that if the thermal impedance Zth(jw)of an electronic package is represented in a Nyquist plot, the curve obtained can be fitted very well to a combination of a few (n) circles, n varying between 2 and a maximum of 5. For each of these circles, it is sufficient to know the radius and the coordinates of the center point or just three parameters. With 3n parameters the entire behavior of the impedance can be represented and consequently, the dynamic behavior as well.Keywords
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