Performance of power dissipation on semiconductor module for different configuration of heat SINK with thermal pad
- 6 April 2024
- journal article
- research article
- Published by Elsevier in International Journal of Thermal Sciences
- Vol. 201
Abstract
No abstract availableKeywords
Funding Information
- Universiti Sains Malaysia
This publication has 36 references indexed in Scilit:
- A three-dimensional thermal management study for cooling a square Light Edding DiodeCase Studies in Thermal Engineering, 2021
- Design and numerical investigations of natural convection heat transfer of a new rippling fin shapeApplied Thermal Engineering, 2020
- Investigating the effect of various fin geometries on the thermal performance of a heat sink under natural convectionHeat Transfer, 2020
- Natural convection in a cross-fin heat sinkApplied Thermal Engineering, 2018
- A new method to optimize natural convection heat sinksHeat and Mass Transfer, 2017
- Orientation effects on natural convective performance of hybrid fin heat sinksApplied Thermal Engineering, 2017
- Topology optimization of heat sinks in natural convection considering the effect of shape-dependent heat transfer coefficientInternational Journal of Heat and Mass Transfer, 2017
- Nusselt number correlation for natural convection from vertical cylinders with triangular finsApplied Thermal Engineering, 2016
- Orientation effects on natural convection heat dissipation of rectangular fin heat sinks mounted on LEDsInternational Journal of Heat and Mass Transfer, 2014
- Optimum design of a radial heat sink under natural convectionInternational Journal of Heat and Mass Transfer, 2011