Influence of interfacial reaction on reactive wettability of molten Ag-Cu-X wt.%Ti filler metal on SiC ceramic substrate and mechanism analysis

This publication has 20 references indexed in Scilit:

• Interfacial characterization in the brazing of silicon nitride to niobium joining using a double interlayer
  Materials Characterization, 2017
• Surface tension of polytetrafluoroethylene and its wetting by aqueous solution of some surfactants and their mixtures
  Applied Surface Science, 2017
• Microstructure and microhardness of an Al-6061 metal matrix composite processed by high-pressure torsion
  Materials Characterization, 2016
• Solder wetting behavior enhancement via laser-textured surface microcosmic topography
  Applied Surface Science, 2016
• Dynamic crack propagation in a heterogeneous ceramic microstructure, insights from a cohesive model
  Acta Materialia, 2015
• Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler
  Materials Science and Engineering: A, 2013
• A diffuse-interface model of reactive wetting with intermetallic formation
  Acta Materialia, 2012
• Dynamics of wetting in reactive metal/ceramic systems: linear spreading
  Acta Materialia, 1996
• Wettability of SiO2 and oxidized SiC by aluminium
  Materials Science and Engineering: A, 1991
• Wetting under chemical equilibrium and nonequilibrium conditions
  The Journal of Physical Chemistry, 1974