Rheological behaviour of a commercial TGDDM-DDS based epoxy matrix during the isothermal cure
Authors:
- 1 May 1984
- journal article
- Published by Springer Nature in Rheologica Acta
- Vol. 23 (3) , 291-296
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Time‐temperature cure behavior of epoxy based structural adhesivesPolymer Engineering & Science, 1979
- Award address formation and properties of network polymeric materialsPolymer Engineering & Science, 1979
- Effect of diffusion control in the glass transition region on critical conversion at the gel point during curing of epoxy resinsPolymer, 1978
- Kinetics of epoxy resin polymerization using differential scanning calorimetryJournal of Applied Polymer Science, 1977