Microstructure and Solute Concentration Analysis of Epitaxial Growth during Wire and Arc Additive Manufacturing of Aluminum Alloy

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Abstract
Microstructure and solute distribution have a significant impact on the mechanical properties of wire and arc additive manufacturing (WAAM) deposits. In this study, a multiscale model, consisting of a macroscopic finite element (FE) model and a microscopic phase field (PF) model, was used to predict the 2319 Al alloy microstructure evolution with epitaxial growth. Temperature fields, and the corresponding temperature gradient under the selected process parameters, were calculated by the FE model. Based on the results of macroscopic thermal simulation on the WAAM process, a PF model with a misorientation angle was employed to simulate the microstructure and competitive behaviors under the effect of epitaxial growth of grains. The dendrites with high misorientation angles experienced competitive growth and tended to be eliminated in the solidification process. The inclined dendrites are commonly hindered by other grains in front of the dendrite tip. Moreover, the solute enrichment near the solid/liquid interface reduced the driving force of solidification. The inclined angle of dendrites increased with the misorientation angle, and the solute distributions near the interface had similar patterns, but various concentrations, with different misorientation angles. Finally, metallographic experiments were conducted on the WAAM specimen to validate the morphology and size of the dendrites, and electron backscattered diffraction was used to indicate the preferred orientation of grains near the fusion line, proving the existence of epitaxial growth.
Funding Information
  • National Natural Science Foundation of China (52205432, 52275376, BK20221118, 2022M723375)
  • Natural Science Foundation of the Higher Education Institutions of Jiangsu Province, China (52205432, 52275376, BK20221118, 2022M723375)
  • China Postdoctoral Science Foundation (52205432, 52275376, BK20221118, 2022M723375)

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