Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices
Authors:
- K. DušekKDK. Dušek
- 1 January 1989
- book chapter
- Published by Springer Nature
- p. 1-48
Abstract
No abstract availableKeywords
This publication has 64 references indexed in Scilit:
- Epoxy Resins: Effect of Amines on Curing Characteristics and PropertiesJournal of Composite Materials, 1986
- Effects of tertiary amine accelerators on curing of epoxide resinsJournal of Polymer Science Part B: Polymer Physics, 1986
- Effects of stoichiometric mixing ratio on epoxy cure—a dielectric analysisPolymer Engineering & Science, 1986
- Simulation of cavity filling and curing in reaction injection moldingPolymer Engineering & Science, 1981
- Metal acetylacetonates as latent accelerators for anhydridehyphen;cured epoxy resinsJournal of Applied Polymer Science, 1981
- Rheological changes during a urethane network polymerizationPolymer Engineering & Science, 1976
- Heat Stability of Brominated Epoxy ResinsI&EC Product Research and Development, 1964
- A Critical Analysis of Crack Propagation LawsJournal of Basic Engineering, 1963
- Silicon Diffused-Element Piezoresistive DiaphragmsJournal of Applied Physics, 1962
- The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming LiquidsJournal of the American Chemical Society, 1955