Novel bi-layer conformal coating for reliability without hermeticity MEMS encapsulation
Authors:
- Jiali WuJWJiali Wu
- R.T. PikeRPR.T. Pike
- C.P. WongCWC.P. Wong
- 1 July 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electronics Packaging Manufacturing
- Vol. 22 (3) , 195-201
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- Vapor Deposition of Parylene Films from PrecursorsMRS Proceedings, 1992
- Adhesion Through Silane Coupling AgentsThe Journal of Adhesion, 1970