Tri-layer soft UV imprint lithography and fabrication of high density pillars
Authors:
- J. ShiJSJ. Shi
- C. PerozCPC. Peroz
- D. PeyradeDPD. Peyrade
- J. SalariJSJ. Salari
- M. BelottiMBM. Belotti
- W.H. HuangWHW.H. Huang
- Y. ChenYCY. Chen
- 1 April 2006
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 83 (4-9) , 1664-1668
Abstract
No abstract availableKeywords
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