Ni‐YSZ Graded Coatings Produced by Dipping
Open Access
- 9 December 2004
- journal article
- research article
- Published by Wiley in Advanced Engineering Materials
- Vol. 6 (12) , 969-971
Abstract
A new colloidal processing route for the shaping of a graded Ni‐YSZ composite for applications in SOFC devices is described. A Ni foil is coated by Ni/YSZ layers by dipping in aqueous suspensions with an organic binder. Behind the metal‐ceramic layers introduced to improve adhesion, an outer thin layer of nanosized YSZ is formed by electrophoretic deposition.Keywords
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