Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)
Authors:
- Panagiotis EvangelopoulosPEPanagiotis Evangelopoulos
- Efthymios KantarelisEKEfthymios Kantarelis
- Weihong YangWYWeihong Yang
- 1 September 2015
- journal article
- Published by Elsevier in Journal of Analytical and Applied Pyrolysis
- Vol. 115, 337-343
Abstract
No abstract availableKeywords
Funding Information
- Swedish Energy Agency
This publication has 19 references indexed in Scilit:
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