Advanced metal ion dipping-steam sealing for enhanced corrosion resistance of hard anodized aluminum in semiconductor plasma etching environments
Authors:
- Yuhang WangYWYuhang Wang
- Bo HeBHBo He
- Yang ZhaoYZYang Zhao
- Tao ZhangTZTao Zhang
- Fuhui WangFWFuhui Wang
- 24 July 2025
- journal article
- Published by Elsevier in Materials Letters
- Vol. 400
Abstract
No abstract availableFunding Information
- National Natural Science Foundation of China (52371055)
- Wuhan University of Science and Technology Zhongnan Branch (Y202404)
- Scientific Research Fund of Liaoning Provincial Education Department (2023JH2/101700305)
- Scientific Research Fund of Liaoning Provincial Education Department (JYTMS20230618)
- Northeastern University
- Hubei Provincial Key Laboratory of Metallurgical Industry Process System Science
- Fundamental Research Funds for the Central Universities (2024GFYD01)
- Fundamental Research Funds for the Central Universities (N2402004)
- Ministry of Education of the People's Republic of China
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