Analysis of nano grinding removal mechanism of 3C-SiC material under the coupling action of double abrasive grains
Authors:
- Xiuting ZhaoXiuting Zhao
- Ziyue WangZWZiyue Wang
- Tonglin ZhaoTZTonglin Zhao
- Ping YangPYPing Yang
- Chong YueCYChong Yue
- 31 May 2023
- journal article
- research article
- Published by Elsevier in Computational Materials Science
- Vol. 227
Abstract
No abstract availableKeywords
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