A high-density MIM capacitor (13 fF/μm/sup 2/) using ALD HfO2 dielectrics

Authors:
  • ACA. Chin
    A. Chin
  • MLM.F. Li
    M.F. Li
  • BCByung Jin Cho
    Byung Jin Cho
  • DKDim-Lee Kwong
    Dim-Lee Kwong
  • PFP.D. Foo
    P.D. Foo
  • MYMing Bin Yu
    Ming Bin Yu

Abstract
Metal-insulator-metal (MIM) capacitors with different HfO/sub 2/ thickness have been investigated. The results show that both the capacitance density and voltage coefficients of capacitance (VCCs) increase with decreasing HfO/sub 2/ thickness. In addition, it is found that the VCCs decrease logarithmically with increasing thickness. Furthermore, the MIM capacitor with 10-nm HfO/sub 2/ shows a record high capacitance density of 13 fF//spl mu/m/sup 2/ and a VCC of 607 ppm/V, which can meet the requirement of the International Technology Roadmap for Semiconductors. It can also provide a low leakage current of 5.95 /spl times/ 10/sup -8/A/cm/sup 2/ at room temperature at 1 V, low tangent values below 0.05, and a small frequency dependence. These results indicate that the devices are suitable for use in silicon integrated circuit applications.