Thermal management of electronic devices using carbon foam and PCM/nano-composite
Authors:
- W.G. AlshaerWAW.G. Alshaer
- S.A. NadaSNS.A. Nada
- M.A. RadyMRM.A. Rady
- Elena Palomo Del BarrioEBElena Palomo Del Barrio
- Alain SommierASAlain Sommier
- 1 March 2015
- journal article
- Published by Elsevier in International Journal of Thermal Sciences
- Vol. 89, 79-86
Abstract
No abstract availableKeywords
Funding Information
- French Embassy in Egypt
- Institut de Mécanique et d'Ingénierie – Bordeaux – France
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