Parameter optimization for an ICP deep silicon etching system
Authors:
- 30 May 2006
- journal article
- Published by Springer Nature in Microsystem Technologies
- Vol. 13 (5-6) , 465-474
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Geometrical pattern effect on silicon deep etching by an inductively coupled plasma systemJournal of Micromechanics and Microengineering, 2004
- Sidewall roughness control in advanced silicon etch processMicrosystem Technologies, 2003
- Recent advances in silicon etching for MEMS using the ASE™ processSensors and Actuators A: Physical, 1999
- Advanced silicon etching using high-density plasmas1995
- Engineering, Quality and Experimental Design.Journal of the American Statistical Association, 1994
- Quality Engineering using Design of Experiments1989