Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates
Authors:
- H. TsukamotoHTH. Tsukamoto
- T. NishimuraTNT. Nishimura
- S. SuenagaSSS. Suenaga
- K. NogitaK. Nogita
- 1 July 2010
- journal article
- Published by Elsevier in Materials Science and Engineering: B
- Vol. 171 (1-3) , 162-171
Abstract
No abstract availableThis publication has 26 references indexed in Scilit:
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