Characterization of solder joints made with VPS on DBC substrate
- 4 October 2016
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 28 (2) , 1769-1776
Abstract
No abstract availableKeywords
Funding Information
- European Regional Development Fund (MIME POIG.01.01.02-00-108/09)
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