High Performance Nanostructured Ni-Mn Alloy for Microsystem Applications

Authors:
  • JKJ. J. Kelly
    J. J. Kelly
  • SGS. H. Goods
    S. H. Goods
  • NYN. Y. C. Yang
    N. Y. C. Yang
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Abstract
A process has been developed for the electrodeposition of a high strength, heat resistant Ni-Mn alloy for high aspect ratio microstructures (HARMST). A conventional Ni sulfamate electrolyte is employed with the addition of a small amount of manganese chloride. The deposits are low stress tensile), enabling the deposition of thick section films required for HARMST. The Mn content for the alloys of interest is less than about 1 wt %, and its codeposition is insensitive to mass-transport effects, permitting uniform alloy deposition, regardless of feature aspect ratio. A pulsed deposition scheme is employed to fabricate a nanostructured film consisting of alternating nanometer thick regions of relatively pure Ni, and hard, Mn-rich Ni; this moderates the high stress of the NiMn alloy and enables the deposition of thick deposits. Yield strengths of over 800 MPa are achievable, with good as-plated ductility The material loses only about 15% of its original strength after a 1 h, 600°C anneal, and no embrittlement is observed since no S-bearing additives are employed. © 2003 The Electrochemical Society. All rights reserved.

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