Thermal Spreading Resistance Inside Anisotropic Plates with Arbitrarily Located Hotspots
Authors:
- 1 October 2014
- journal article
- research article
- Published by American Institute of Aeronautics and Astronautics (AIAA) in Journal of Thermophysics and Heat Transfer
- Vol. 28 (4) , 679-686
Abstract
Graphite-based anisotropic materials are becoming the key component of next-generation cooling systems in electronics and telecommunication industries. Proper use of these materials in the form of thermal spreaders, compared to conventional metallic ones, can significantly reduce the thermal stress and thermal resistance in the system. In this study, a new analytical model for temperature distribution inside anisotropic rectangular plates subjected to multiple sources and sinks on the top and bottom surfaces is presented. All lateral faces are assumed insulated. The solution is first justified for the case with single hotspots on each side and then using the superposition principle, it is extended into the general form to cover multihotspot cases. The model is validated by numerical simulation data and a perfect agreement is observed. Thermal spreading resistance is defined for the anisotropic plate and a comprehensive parametric study for optimization purpose is performed. The influence of both anisotrop...Keywords
This publication has 15 references indexed in Scilit:
- Synthesis of Soluble Graphite and GrapheneAccounts of Chemical Research, 2012
- Functionalization of Graphene for Efficient Energy Conversion and StorageAccounts of Chemical Research, 2012
- Performance of Isotropic and Anisotropic Heat SpreadersJournal of Electronic Materials, 2012
- A unified compact model of electrical and thermal 3-D spreading resistance between eccentric rectangular and circular contactsIEEE Electron Device Letters, 2005
- Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux ChannelsJournal of Electronic Packaging, 2003
- Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series SolutionJournal of Electronic Packaging, 2000
- Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux ChannelsJournal of Thermophysics and Heat Transfer, 1999
- An exact recursion relation solution for the steady-state surface temperature of a general multilayer structureIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- An analysis of the thermal response of power chip packagesIEEE Transactions on Electron Devices, 1985
- Thermal analysis of multiple-layer structuresIEEE Transactions on Electron Devices, 1974