Properties and Microstructures of Sn-Bi-X Lead-Free Solders

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Abstract
The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.
Funding Information
  • Research Innovation Project for College Graduate of Jiangsu Province (KYZZ16_0469, 51475220, SKLABFMT-2015-03, XCL-022, YQ2015002)
  • National Natural Science Foundation of China (KYZZ16_0469, 51475220, SKLABFMT-2015-03, XCL-022, YQ2015002)
  • Zhengzhou Research Institute of Mechanical Engineering (KYZZ16_0469, 51475220, SKLABFMT-2015-03, XCL-022, YQ2015002)
  • Six Kind Skilled Personnel Project of Jiangsu Province (KYZZ16_0469, 51475220, SKLABFMT-2015-03, XCL-022, YQ2015002)
  • Qing Lan Project and High Level Talent Plan of Jiangsu Normal University (KYZZ16_0469, 51475220, SKLABFMT-2015-03, XCL-022, YQ2015002)
  • Jiangsu Normal University (KYZZ16_0469, 51475220, SKLABFMT-2015-03, XCL-022, YQ2015002)

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