The influence of curing conditions on the strength of adhesive joints
Author:
- 26 August 2019
- journal article
- research article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 96 (1-4) , 402-422
Abstract
The objective of this study was to determine the effect of selected curing conditions on the mechanical properties of the cured adhesive compounds and adhesive joints made with these adhesives. Four different two-component epoxy adhesive compounds were investigated in the study. All of them were based on Epidian 53 epoxy resin and were prepared using four types of curing agents: polyamide, two amines and Mannich base. The aforementioned adhesives were used to fabricate single-lap joints of C45 steel and produce samples of the cured adhesive compounds. Four different curing methods were employed in the study: (i) samples were cured in room conditions; (ii) samples were cured for 7 days in room conditions and then for 7 days in a climate test chamber; (iii) samples were seasoned for 4 days in room conditions and then for 7 days in a climate test chamber; (iv) samples were cured for 7 days in a climate test chamber. It has been found that 3 out of 4 adhesive compounds examined in the study show the highest tensile strength when not cured in room conditions (curing variant IV). Therefore, it may be claimed that high-temperature curing has a positive effect on the strength of adhesive compounds.Keywords
This publication has 30 references indexed in Scilit:
- Effects of low-temperature curing on physical behavior of cold-curing epoxy adhesives in bridge constructionInternational Journal of Adhesion and Adhesives, 2012
- Modification of hydrogenated Bisphenol A epoxy adhesives using nanomaterialsInternational Journal of Adhesion and Adhesives, 2011
- Thermal curing and photocuring of an epoxy resin modified with a hyperbranched polymerThermochimica Acta, 2010
- Error identification with a spinning mirror for holography systemProceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 2009
- Epoxy/POSS organic–inorganic hybrids: ATR-FTIR and DSC studiesEuropean Polymer Journal, 2008
- Fast-curing adhesive compositions based on modified epoxy resinsPolymer Science, Series C, 2007
- Characteristics of epoxy resin cured with in situ polymerized curing agentPolymer, 2002
- Cure kinetics and ultimate properties of a tetrafunctional epoxy resin toughened by a perfluoro-ether oligomerPolymer, 2001
- A New epoxy/episulfide resin system for coating applications: Curing Mechanism and PropertiesInternational Journal of Adhesion and Adhesives, 2000
- Surface properties of an anhydride-epoxy resin cured against different mould surfacesJournal of Adhesion Science and Technology, 1993