Progress in the design of new lead-free solder alloys

Authors:

Publisher website

1 July 1993

journal article
lead free-solder
Published by Springer Nature in JOM

Vol. 45 (7) , 36-40
DOI:10.1007/bf03222379

Abstract

No abstract available

Keywords

This publication has 4 references indexed in Scilit:

The effect of reflow process variables on the wettability of lead-free solders
JOM, 1993
Microstructure and mechanical properties of Sn-In and Sn-Bi solders
JOM, 1993
The properties of tin-bismuth alloy solders
JOM, 1993
Issues in the replacement of lead-bearing solders
JOM, 1993