Effects of Cu and Cu/Ti interlayer on adhesion of diamond film
Authors:
- Yangfeng HuangYHYangfeng Huang
- Hanning XiaoHXHanning Xiao
- Zhibin MaZMZhibin Ma
- Jianhua WangJWJianhua Wang
- Pengzhao GaoPGPengzhao Gao
- 15 November 2007
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 202 (1) , 180-184
Abstract
No abstract availableThis publication has 17 references indexed in Scilit:
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