Heat dissipation design and analysis of high power LED array using the finite element method
Authors:
- Hui Huang ChengHCHui Huang Cheng
- De-Shau HuangDHDe-Shau Huang
- Ming-Tzer LinMLMing-Tzer Lin
Top Cited Papers
- 1 May 2012
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 52 (5) , 905-911
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Thermal diffusion analysis for LED moduleHeat Transfer, 2007
- Thermal analysis of LED array system with heat pipeThermochimica Acta, 2007
- A practical implementation of silicon microchannel coolers for high power chips2005
- Chip-scale thermal management of high-brightness LED packages2004
- Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devicesElectronics Letters, 1987
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981