Effects of Surface Roughness on Solder Bump Formation by Direct Droplet Deposition
Authors:
- Jung-Hoon ChunJCJung-Hoon Chun
- Wayne HsiaoWHWayne Hsiao
- 31 December 2003
- journal article
- Published by Elsevier in CIRP Annals
- Vol. 52 (1) , 161-164
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface MaterialsJournal of Heat Transfer, 2001
- Effects of surface roughness on wettabilityActa Materialia, 1998
- Spread and rebound of liquid droplets upon impact on flat surfacesAIChE Journal, 1997
- Splat-quench solidification: estimating the maximum spreading of a droplet impacting a solid surfaceJournal of Materials Science, 1993