Flotation-assisted electrodeposition process to recover copper from waste printed circuit boards
Authors:
- Yamin LiYLYamin Li
- Xuehao WeiXWXuehao Wei
- Hongjun LiuHLHongjun Liu
- Yan SunYSYan Sun
Open Access
- 13 August 2024
- journal article
- research article
- Published by Elsevier in Chemical Engineering Journal
- Vol. 497
Abstract
No abstract availableKeywords
Funding Information
- State Key Laboratory of Remote Sensing Science (18LHPY008)
This publication has 32 references indexed in Scilit:
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