2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration
Authors:
- 1 May 2022
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 30-37
Abstract
fan-out chip-last panel-level packaging for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication and reliability of: (a) the heterogeneous integration of one large chip and one small chip with 50μm-pitch (minimum), (b) a fine metal linewidth and spacing redistribution-layer substrate on a temporary glass carrier, (c) an ordinary build-up package substrate on a panel, (d) a hybrid substrate which is by soldering the redistribution-layer substrate on top of the build-up substrate, and (e) the chips to hybrid substrate bonding and underfilling. The dielectric material for the redistribution-layer substrate is an Ajinomoto build-up film. The design and analysis of the heterogeneous integration of the two-chip package on the hybrid substrate are performed by a nonlinear temperature- and time-dependent finite-element method.Keywords
This publication has 18 references indexed in Scilit:
- Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package2020
- Assembly and Reliability of Lead-Free Solder Joints2020
- Development of 2.3D High Density Organic Package using Low Temperature Bonding Process with Sn-Bi Solder2019
- Multilayer RDL Interposer for Heterogeneous Device and Module Integration2019
- Ultra High Density IO Fan-Out Design Optimization with Signal Integrity and Power Integrity2019
- Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages2018
- Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications2018
- Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate2016
- A Novel System in Package with Fan-Out WLP for High Speed SERDES Application2016
- Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions2013