High temperature creep and fracture properties of a class I solid solution alloy: Cu-2.7 at.% Sn
Authors:
- J.S. WangJWJ.S. Wang
- W.D. NixWNW.D. Nix
Open Access
- 1 March 1986
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 34 (3) , 545-555
Abstract
No abstract availableKeywords
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