Thermal behavior, interfacial reaction, and mechanical properties of SnPbAg–SnAgCu hybrid solder joints on Au/Ni/MoCu substrates in microwave modules
Authors:
- Mingyue XiongMXMingyue Xiong
- Honghua SuHSHonghua Su
- Biao ZhaoBZBiao Zhao
- Tao ChenTCTao Chen
- Guangzi WangGWGuangzi Wang
- Lei SunLSLei Sun
- Yucan FuYFYucan Fu
- Wenfeng DingWDWenfeng Ding
- Zhenghu ZhuZZZhenghu Zhu
- Fan PuFPFan Pu
Abstract
No abstract availableFunding Information
- National Natural Science Foundation of China (52175415)
- National Natural Science Foundation of China (52205475)
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