A study of mini-channel thermal module design for achieving high stability and high capability in electronic cooling
Authors:
- Hsiang-Li WangHWHsiang-Li Wang
- Huang-Ching WuHWHuang-Ching Wu
- S. Kong WangSWS. Kong Wang
- Tzu-Chen HungTHTzu-Chen Hung
- Ruey-Jen YangRuey-Jen Yang
- 1 March 2013
- journal article
- Published by Elsevier in Applied Thermal Engineering
- Vol. 51 (1-2) , 1144-1153
Abstract
No abstract availableFunding Information
- National Science Council of Taiwan (NSC96-2221-E-214-043)
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