Whole Inorganic Hermetic Packaging Technology Using Localized Induction Heating for Deep Ultraviolet Light-Emitting Diodes

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Abstract
A uniform, reproducible, and whole inorganic hermetic packaging technology using localized induction heating and its application to deep ultraviolet light-emitting diode (DUV-LED) packaging with glass cap have been proposed and demonstrated. By localized induction heating and inorganic packaging materials, the DUV-LED was rapidly packaged, which eliminates thermal damages during packaging process and avoids UV aging during its long-time service. At certain conditions, such as a treating period from 2 to 16 s and an output power from 1 to 6 kW, the bonding between ceramics and glass using Sn/Cu solder was achieved. The experimental measurement results indicate that localized induction heating packaging improves the electrical and optical characteristics of DUV-LED compared to global heating packaging.
Funding Information
  • National Natural Science Foundation of China (51275194)
  • Fundamental Research Funds for the Central University (2015TS060)
  • Open Foundation of State Key Laboratory of Digital Manufacturing Equipment & Technology (DMET 2015019)
  • Innovation Foundation of Graduate Innovation and Entrepreneurship Base of HUST (2015650011)

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