Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance
Authors:
- 23 September 2022
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science
- Vol. 57 (36) , 17491-17502
Abstract
No abstract availableKeywords
Funding Information
- The key technology and application of high-performance green nano-nickel/carbon reinforced composite brazing filler metal brazing (222102230114)
This publication has 30 references indexed in Scilit:
- Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of NiMaterials & Design (1980-2015), 2013
- High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics ApplicationsJournal of Electronic Materials, 2012
- Effect of Zn on properties and microstructure of SnAgCu alloyJournal of Materials Science: Materials in Electronics, 2012
- Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solderMaterials & Design (1980-2015), 2010
- Marangoni convection, evaporation and interface deformation in liquid films on heated substrates with non-uniform thermal conductivityInternational Journal of Heat and Mass Transfer, 2010
- Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layerJournal of Alloys and Compounds, 2009
- Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary CharacterJournal of Electronic Materials, 2008
- Influencing factors on the uniformity of copper coated nano-Al2O3 powders prepared by electroless platingMaterials Letters, 2005
- ForumFunctional Ecology, 2003
- The influence of nickel coating on the wettability of aluminum on ceramicsComposites Part A: Applied Science and Manufacturing, 2002