Gate lifetime investigation at low temperature for p-GaN HEMT
Authors:
- M. AlamMAM. Alam
- V. RustichelliVRV. Rustichelli
- M. ZerarkaMZM. Zerarka
- C. BancCBC. Banc
- J. PieprzykJPJ. Pieprzyk
- O. PerrotinOPO. Perrotin
- R. CeccarelliRCR. Ceccarelli
- D. TrémouillesDTD. Trémouilles
- M. MatmatMMM. Matmat
- F. CoccettiFCF. Coccetti
- 11 March 2025
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 168
Abstract
No abstract availableFunding Information
- Agence Nationale de la Recherche
This publication has 8 references indexed in Scilit:
- Main Mechanism Responsible for pGaN Gate Breakdown and Lifetime Projection in GaN HEMTsIEEE Transactions on Electron Devices, 2024
- Negative Activation Energy of Gate Reliability in Schottky-Gate p-GaN HEMTs: Combined Gate Leakage Current Modeling and Spectral Electroluminescence InvestigationIEEE Journal of the Electron Devices Society, 2024
- Stability, Reliability, and Robustness of GaN Power Devices: A ReviewIEEE Transactions on Power Electronics, 2023
- Challenges and Opportunities for High-Power and High-Frequency AlGaN/GaN High-Electron-Mobility Transistor (HEMT) Applications: A ReviewMicromachines, 2022
- GaN Power Integration for High Frequency and High Efficiency Power Applications: A ReviewIEEE Access, 2020
- Temperature-Dependent Gate Degradation of $p$-GaN Gate HEMTs under Static and Dynamic Positive Gate Stress2019
- Investigation of the p-GaN Gate Breakdown in Forward-Biased GaN-Based Power HEMTsIEEE Electron Device Letters, 2016
- Time-Dependent Failure of GaN-on-Si Power HEMTs With p-GaN GateIEEE Transactions on Electron Devices, 2016